SURCLEAN 201-204 Process Documentation (English Version)
It is a pretreatment material used mainly in Japan for selective silver plating processes for semiconductor sheets.
This is a plating chemical for semiconductor back-end processes, selective silver plating for semiconductors, and plating related to connectors, boasting nearly 40 years of achievements in Japan. It has particularly strong results with major Japanese companies. Mainly used domestically in Japan, it is a pretreatment material for the selective silver plating process for semiconductor sheets. For more details, please download the PDF (technical documentation in English).
- 企業：河口・サポート 名古屋事務所
- 価格：Other
